Aluminium Nitride Nanopowder possesses high purity, narrow range particle size distribution, larger specific surface area, lower bulk density and better shaping injection molding properties.
Aluminium nitride nano powder is used in composite, and it has a good match with the semiconductor silicon and its good interface compatibility improves the mechanical properties and thermal conductivity of composite material.
|Item||Purity||APS||Color||Bulk Density||Crystallographic Form||oxygen content||Making method||SSA|
|Aluminium Nitride Nanopowder||99%||50nm||Grey||0.05g/cm3||Hexagonal structure||0.80%||Plasma CVD||105m2/g|
Aluminum Nitride nanopowder used to improve the performance of epoxy resin In Aluminum nitride nanopowder and epoxy resin system, when the content of Aluminum nitride nanoparticle reaches to 1%~5%, glass-transition temperature increases and module of elasticity reaches the maximum value.
The adding of Aluminum nitride nanopowder to epoxy resin compound materials is completely different from the adding of Aluminum nitirde micro grain in structure. It is usually added as a kind of reinforcing agent and mainly distributed between the chains of polymer material. For insufficient coordination on the surface and large specific surface area, it shows very strong activity.
Meanwhile, part of Aluminum nitride nanoparticles grains are distributed in the spacing of polymer chain. Comparing to Aluminum nitride micro grain, Aluminum nitride nanopowder possesses very good fluidity and can largely improve the intensity, tenacity and tractility of epoxy resin.
Used for Heat Conductive Material
The silica gel compounded with Aluminum nitride nanoparticles, which has super thermal conductivity, gives very excellent thermal conductivity, electrical insulation, wider working temperature of electrical insulation (-60°C~-200°C), lower thickness and good operation performance, and can be widely used in the thermal transmission medium of electronic component to improve working efficiency, such as CPU radiator filler, high-power audion, controllable Silicon components, diode, thermal transmission medium in the seam and so on.
Aluminum Nitride Nanopowder powder can largely improve the thermal conductivity of plastic. By adding Aluminum nitride nanoparticles to plastic according to the proportion of 5%~10% in mass, we can increase the thermal conductivity of plastic from 0.3W/(m.k) to 0.5W/(m.k), 16 times more. Compared with the heat conduction stuffing (alumina or magnesia) in the market, it can improve the mechanical properties of products with smaller amount.
At present, related manufacturers have purchased Aluminum Nitride Nanopowder powders in mass and the new-type nano heat conduction plastic will be launched to market.
Aluminum Nitride Nanopowder powder works very well in silicon dioxide and tends to disperse in rubber. Under the premise of making no difference to the mechanical performance of rubber, (experiments proved that it could improve the mechanical performance of rubber), it can largely improve the heat conductivity of rubber and will not lower down the viscosity like other oxides during adding process, and only very small amount is required. It has been widely applied to military, aviation and information engineering.
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the product should be avoided under stress.